QBIC printed circuit board inspection

QBIC printed circuit board inspection Project type: Electronics Date 2021 The boards in the customer area should first be offline, later also inline by means of image processing are controlled. Requirements • Detection of missing components • Localization of incorrect positioning of components • Delamination of components (e.g. Soldering Detection of defective components Detection of partially defective components • Detection of the coating material: protective lacquer present / partially present Detection of foreign bodies (dirt, sticking residues etc.) • Inline measurement • Offline measurement • Detection of cracks on board and components • critical, because there are no sample parts yet A cell will be offered for testing in the laboratory. This cell can later be added 1:1 in the production are integrated in order to carry out the tests inline.